IEC 60191-6-5:2001
Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
Abstract
Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch ball grid array the terminal pitch of which is less than or equal to 0,80 mm.
Additional information
Publication type | International Standard |
---|---|
Publication date | 2001-08-27 |
Edition | 1.0 |
Available language(s) | English, Spanish |
TC/SC | TC 47/SC 47D - Semiconductor devices packagingrss |
ICS | 31.080.01 - Semiconductor devices in general |
Stability date | 2027 |
Pages | 10 |
File size | 309 KB |
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