Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
|Publication type||International Standard|
|Available language(s)||English, Spanish|
|TC/SC||TC 47/SC 47D - Semiconductor devices packagingrss|
|ICS||31.080.01 - Semiconductor devices in general|
|File size||309 KB|
The following test report forms are related:
Share your publications
Learn how to share your publications with your colleagues, using networking options.
Our prices are in Swiss francs (CHF). We accept all major credit cards (American Express, Mastercard and Visa, JCB and CUP), PayPal and bank transfers as form of payment.
Keep in touch
Keep up to date with new publication releases and announcements with our free IEC Just Published email newsletter.
Contact customer services
Please send your enquiry by email or call us on +41 22 919 02 11 between 09:00 – 17:00 CET Monday to Friday.