IEC 60191-6-5:2001 

Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)

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Abstract

Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch ball grid array the terminal pitch of which is less than or equal to 0,80 mm.

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Additional information

Publication typeInternational Standard
Publication date2001-08-27
Edition1.0
Available language(s)English, Spanish
TC/SCTC 47/SC 47D - Semiconductor devices packagingrss
ICS31.080.01 - Semiconductor devices in general
Stability date  2020
Pages10
File size309 KB

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