IEC 60191-6-6:2001
Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)
Abstract
IEC 60191-6-6:2001 provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array (hereinafter called FLGA) whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is square.
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Additional information
| Publication type | International Standard |
|---|---|
| Publication date | 2001-03-22 |
| Edition | 1.0 |
| Available language(s) | English, English/French |
| TC/SC | TC 47/SC 47D - Semiconductor devices packagingrss |
| ICS | 31.080.01 - Semiconductor devices in general |
| Stability date | 2027 |
| Pages | 25 |
| File size | 988 KB |
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