Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
a) scope is modified to cover all surface-mounted devices discrete semiconductors with lead count of greater or equal to 8;
b) editorial modifications on several pages; and
c) technical revision to ball grid array package (BGA) especially its geometrical drawing format. (two types of BGA would unify as one type as a result of revising drawing format.
|Publication type||International Standard|
|TC/SC||TC 47/SC 47D - Semiconductor devices packagingrss|
|ICS||31.080.01 - Semiconductor devices in general|
|File size||1285 KB|
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