IEC 60317-2:2012 Withdrawn

Specifications for particular types of winding wires - Part 2: Solderable polyurethane enamelled round copper wire, class 130, with a bonding layer

Note: this publication has been replaced by IEC 60317-2:2019

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Abstract

IEC 60317-2:2012 specifies the requirements of solderable enamelled round copper winding wire of class 130 with a dual coating. The underlying coating is based on polyurethane resin, which may be modified providing it retains the chemical identity of the original resin and meets all specified wire requirements. The superimposed coating is a bonding layer based on a thermoplastic resin. A modified resin is a resin that has undergone a chemical change, or contains one or more additives to enhance certain performance or application characteristics. This edition includes the following significant technical changes with respect to the previous edition:
- addition of requirements for appearance, new subclause 3.3 and
- addition of pin hole test requirements, Clause 23: Pin hole test. Keywords: copper winding wire

This publication is to be read in conjunction with IEC 60317-0-1:2008.

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Additional information

Publication typeInternational Standard
Publication date2012-07-12
Edition4.0
Available language(s)English/French, Spanish
TC/SCTC 55 - Winding wiresrss
ICS29.060.10 - Wires
Stability date  2019
Pages24
File size965 KB

The following test report forms are related:


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