IEC 61709:1996 Withdrawn

Electronic components - Reliability - Reference conditions for failure rates and stress models for conversion


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Gives guidance on the use of failure rate data for the reliability prediction of components in electronic equipment. Reference conditions for failure rate data are specified, so that data from different sources can be compared. The reference conditions adopted are typical of the majority of applications of components in equipment (e.g. telecommunication use, data processing). In this standard it is assumed that the failure rate used under reference conditions is specific to the component i.e. it includes the effect of complexity, technology of the casing, dependence on manufacturers and the manufacturing process, etc.

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Additional information

Publication typeInternational Standard
Publication date1996-10-17
Available language(s)English/French, Spanish
TC/SCTC 56 - Dependabilityrss
ICS31.020 - Electronic components in general
File size662 KB

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