IEC PAS 62191:2000 Withdrawn
Acoustic microscopy for nonhermetic encapsulated electronic components
Note: this publication has been replaced by IEC 60749:1996/AMD2:2001
Abstract
Defines the procedures for performing acoustic microscopy on nonhermetic encapsulated electronic components. Provides users with an acoustic microscopy process flow for detecting anomalies (delamination, cracks, mold compounds voids, etc.) nondestructively in plastic packages while achieving reproducibility.
Additional information
Publication type | Publicly Available Specification |
---|---|
Publication date | 2000-11-28 |
Withdrawal date | 2001-10-17 |
Edition | 1.0 |
Available language(s) | English |
TC/SC | TC 47 - Semiconductor devicesrss |
ICS | 31.080.01 - Semiconductor devices in general |
Stability date | 2001 |
Pages | 16 |
File size | 209 KB |
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