IEC PAS 62191:2000 Withdrawn

Acoustic microscopy for nonhermetic encapsulated electronic components

Note: this publication has been replaced by IEC 60749:1996/AMD2:2001


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Defines the procedures for performing acoustic microscopy on nonhermetic encapsulated electronic components. Provides users with an acoustic microscopy process flow for detecting anomalies (delamination, cracks, mold compounds voids, etc.) nondestructively in plastic packages while achieving reproducibility.

Additional information

Publication typePublicly Available Specification
Publication date2000-11-28
Available language(s)English
TC/SCTC 47 - Semiconductor devicesrss
ICS31.080.01 - Semiconductor devices in general
File size209 KB

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