IEC PAS 62293:2001 Withdrawn

Qualification and performance specification for high density interconnect (HDI) layers or boards (IPC 6016)

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Abstract

Establishes the specific requirements for organic high-density interconnect layers with microvia technology as well as the quality and reliability assurance requirements that shall be met for their acquisition.

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Additional information

Publication typePublicly Available Specification
Publication date2001-11-28
Withdrawal date2004-10-29
Edition1.0
Available language(s)English
TC/SCTC 91 - Electronics assembly technologyrss
ICS33.200 - Telecontrol. Telemetering
Pages60
File size465 KB

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