IEC PAS 62293:2001 Withdrawn
Qualification and performance specification for high density interconnect (HDI) layers or boards (IPC 6016)
Abstract
Establishes the specific requirements for organic high-density interconnect layers with microvia technology as well as the quality and reliability assurance requirements that shall be met for their acquisition.
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Additional information
| Publication type | Publicly Available Specification |
|---|---|
| Publication date | 2001-11-28 |
| Withdrawal date | 2004-10-29 |
| Edition | 1.0 |
| Available language(s) | English |
| TC/SC | TC 91 - Electronics assembly technologyrss |
| ICS | 33.200 - Telecontrol. Telemetering |
| Stability date | 2004 |
| Pages | 60 |
| File size | 465 KB |
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