IEC 62047-17:2015
Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films
Abstract
IEC 62047-17:2015 specifies the method for performing bulge tests on the free-standing film that is bulged within a window. The specimen is fabricated with micro/nano structural film materials, including metal, ceramic and polymer films, for MEMS, micromachines and others. The thickness of the film is in the range of 0,1 μ to 10 μ, and the width of the rectangular and square membrane window and the diameter of the circular membrane range from 0,5 mm to 4 mm. The tests are carried out at ambient temperature, by applying a uniformly-distributed pressure to the testing film specimen with bulging window. Elastic modulus and residual stress for the film materials can be determined with this method.
Additional information
Publication type | International Standard |
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Publication date | 2015-03-05 |
Edition | 1.0 |
Available language(s) | English/French |
TC/SC | TC 47/SC 47F - Micro-electromechanical systemsrss |
ICS | 31.080.99 - Other semiconductor devices |
Stability date | 2027 |
Pages | 54 |
File size | 1675 KB |
The following test report forms are related:
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