IEC 62047-17:2015 

Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films

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Abstract

IEC 62047-17:2015 specifies the method for performing bulge tests on the free-standing film that is bulged within a window. The specimen is fabricated with micro/nano structural film materials, including metal, ceramic and polymer films, for MEMS, micromachines and others. The thickness of the film is in the range of 0,1 μ to 10 μ, and the width of the rectangular and square membrane window and the diameter of the circular membrane range from 0,5 mm to 4 mm. The tests are carried out at ambient temperature, by applying a uniformly-distributed pressure to the testing film specimen with bulging window. Elastic modulus and residual stress for the film materials can be determined with this method.

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Additional information

Publication typeInternational Standard
Publication date2015-03-05
Edition1.0
Available language(s)English/French
TC/SCTC 47/SC 47F - Micro-electromechanical systemsrss
ICS31.080.99 - Other semiconductor devices
Stability date  2022
Pages54
File size1675 KB

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