IEC 62047-15:2015 Withdrawn
Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass
|Publication type||International Standard|
|TC/SC||TC 47/SC 47F - Micro-electromechanical systemsrss|
|ICS||31.080.99 - Other semiconductor devices|
|File size||1192 KB|
The following test report forms are related:
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