Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Note: a more recent version of this publication exists
IEC 60068-2-58:2015+AMD1:2017 CSV
- the addition of Sn-Bi low temperature solder alloy;
- the addition of several reflow test conditions in Table 7 - Resistance to soldering heat - Test conditions and severity, reflow method;
- introduction of reflow test method for Test Td3: Dewetting and resistance to dissolution of metallization;
- implementation of guidance for the choice of a test severity in Clause B.3.
|Publication type||International Standard|
|TC/SC||TC 91 - Electronics assembly technologyrss|
|ICS||19.040 - Environmental testing
31.190 - Electronic component assemblies
|File size||2219 KB|
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