IEC PAS 62878-2-5:2015 Withdrawn
Device embedded substrate - Guidelines - Data format
Abstract
IEC PAS 62878-2-5:2015(E) defines the data format for active and passive devices embedded inside an organic board whose electrical connections are made by means of a via, electroplating, conductive paste or printing of conductive material. This PAS describes the expression of 3D data information, the concept of layers, the structure of board data, and definitions of information repeatedly used in design.
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Additional information
| Publication type | Publicly Available Specification |
|---|---|
| Publication date | 2015-08-05 |
| Withdrawal date | 2019-09-16 |
| Edition | 1.0 |
| Available language(s) | English |
| TC/SC | TC 91 - Electronics assembly technologyrss |
| ICS | 31.180 - Printed circuits and boards 31.190 - Electronic component assemblies |
| Stability date | 2019 |
| Pages | 37 |
| File size | 3177 KB |
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