Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)
a) BGA package nominal length and width have been newly expanded to 43 mm and 43 mm, respectively. Accordingly, six socket sizes have been added to the socket group numbers 1, 2 and 3, and twenty-two socket sizes have been added to the socket group number 4.
|Publication type||International Standard|
|TC/SC||TC 47/SC 47D - Semiconductor devices packagingrss|
|ICS||31.080.01 - Semiconductor devices in general|
|File size||1755 KB|
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