IEC 60191-6-13:2016 

Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)

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Abstract

IEC 60191-6-13:2016 specifies a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA). In particular, this part of IEC 60191 establishes the outline drawings and dimensions of the open-top-type test and burn-in sockets applied to FBGA and FLGA. This edition includes the following significant technical changes with respect to the previous edition:
a) BGA package nominal length and width have been newly expanded to 43 mm and 43 mm, respectively. Accordingly, six socket sizes have been added to the socket group numbers 1, 2 and 3, and twenty-two socket sizes have been added to the socket group number 4.

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Additional information

Publication typeInternational Standard
Publication date2016-09-27
Edition2.0
Available language(s)English/French
TC/SCTC 47/SC 47D - Semiconductor devices packagingrss
ICS31.080.01 - Semiconductor devices in general
Stability date  2027
Pages36
File size1755 KB

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