Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
Note: a redline version of this publication exists
IEC 60286-3:2019 RLV
IEC 60286-3:2019 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. This document also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips). This edition includes the following significant technical changes with respect to the previous edition:
- addition of a table of the classification to symbols concerning tape, reel and common symbols;
- additions of a figure of example of polarity and orientation and a figure of example of dot seal;
- revision of requirements for camber;
- addition of a definition of design value with regard to tilt.
|Publication type||International Standard|
|TC/SC||TC 40 - Capacitors and resistors for electronic equipmentrss|
|ICS||31.020 - Electronic components in general
31.240 - Mechanical structures for electronic equipment
|File size||3082 KB|
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