IEC 60749-5:2017 Withdrawn
Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
Abstract
IEC 60749-5:2017 provides a steady-state temperature and humidity bias life test for the purpose of evaluating the reliability of non-hermetic packaged solid-state devices in humid environments.
This second edition cancels and replaces the first edition published in 2003. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous edition:
a) correction of an error in an equation;
b) inclusion of notes for guidance;
c) clarification of the applicability of test conditions.
This second edition cancels and replaces the first edition published in 2003. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous edition:
a) correction of an error in an equation;
b) inclusion of notes for guidance;
c) clarification of the applicability of test conditions.
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Additional information
| Publication type | International Standard |
|---|---|
| Publication date | 2017-04-10 |
| Withdrawal date | 2023-12-19 |
| Edition | 2.0 |
| Available language(s) | English, English/French |
| TC/SC | TC 47 - Semiconductor devicesrss |
| ICS | 31.080.01 - Semiconductor devices in general |
| Stability date | 2023 |
| Pages | 18 |
| File size | 1108 KB |
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