IEC TS 62647-4:2018(E) defines the requirements for replacing solder balls on ball grid array (BGA) component packages in the context of an electronic components management plan (ECMP) for aerospace, defence and high reliability products. The intent of this document is to provide re-balling companies (hereinafter referred to as the re-balling provider) with the administrative and technical requirements to be incorporated within existing processes or for establishing, implementing and maintaining a new set of processes or the creation of a stand-alone re-balling process.