IEC TS 62647-4:2018
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 4: Ball grid array (BGA) re-balling
|Publication type||Technical Specification|
|TC/SC||TC 107 - Process management for avionicsrss|
|ICS||03.100.50 - Production. Production management|
31.020 - Electronic components in general
49.060 - Aerospace electric equipment and systems
|File size||1321 KB|
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