IEC TS 62647-4:2018 

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 4: Ball grid array (BGA) re-balling


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IEC TS 62647-4:2018(E) defines the requirements for replacing solder balls on ball grid array (BGA) component packages in the context of an electronic components management plan (ECMP) for aerospace, defence and high reliability products. The intent of this document is to provide re-balling companies (hereinafter referred to as the re-balling provider) with the administrative and technical requirements to be incorporated within existing processes or for establishing, implementing and maintaining a new set of processes or the creation of a stand-alone re-balling process.

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Additional information

Publication typeTechnical Specification
Publication date2018-04-10
Available language(s)English
TC/SCTC 107 - Process management for avionicsrss
ICS03.100.50 - Production. Production management
31.020 - Electronic components in general
49.060 - Aerospace electric equipment and systems
Stability date  2022
File size1321 KB

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