IEC 62951-5:2019 

Semiconductor devices - Flexible and stretchable semiconductor devices - Part 5: Test method for thermal characteristics of flexible materials


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IEC 62951-5:2019 specifies the test method for thermal characteristics of flexible materials. This document includes terms, definitions, symbols, and test methods that can be used to evaluate and determine thermal characteristics of flexible materials for practical use. The measurement method relies on non-contact optical thermometry that is based on temperature dependent optical reflectance. This document is applicable to both substrate and thin-film flexible semiconductor materials that are subjected to bending and stretching.

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Additional information

Publication typeInternational Standard
Publication date2019-02-27
Available language(s)English/French
TC/SCTC 47 - Semiconductor devicesrss
ICS31.080.99 - Other semiconductor devices
Stability date  2023
File size2250 KB

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