IEC 60691:2002+AMD1:2006+AMD2:2010 CSV Withdrawn
Consolidated version
Thermal-links - Requirements and application guide
Abstract
IEC 60691:2002+A1:2006+A2:2010 Applies to thermal-links, intended for incorporation in electrical appliances, electronic equipment and component parts thereof, normally intended for use indoors, in order to protect them against excessive temperatures under abnormal conditions. May be applicable to thermal-links for use under other than indoor conditions, provided that the climatic and other circumstances in the immediate surroundings of such thermal-links are comparable with those in this standard.
This consolidated version consists of the third edition (2002),
its amendment 1 (2006) and its amendment 2 (2010). Therefore, no
need to order amendments in addition to this publication.
Additional information
Publication type | International Standard |
---|---|
Publication date | 2010-02-25 |
Edition | 3.2 |
Available language(s) | English/French |
TC/SC | TC 32/SC 32C - Miniature fusesrss |
ICS | 29.120.50 - Fuses and other overcurrent protection devices |
Pages | 154 |
File size | 4248 KB |
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