Extended thermal cycling of PV modules - Test procedure
The test procedure in this document was developed based on analysis of the stress on tin-lead solder bonds on crystalline silicon solar cells in a glass superstrate type package. Changes to lead-free solder have an effect on the acceleration factors but not enough to change the overall results of this test. Monolithic type modules with integral cell interconnection do not suffer from this specific type of stress but there are still electrical connections within the module, for example between the integrated cell circuit and the module bus bars, that may be subject to wear out from thermal cycling. Flexible modules (without glass) are not stressed in the same way as those with glass superstrates or substrates, therefore use of the equivalency factor employed in this document may not be applicable to these modules.
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