Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate
This data format is to be used for simulation (e.g. stress, thermal, EMC), tooling, manufacturing, assembly, and inspection requirements. Furthermore, the data format is used for transferring information among printed board designers, printed board simulation engineer, manufacturers, and assemblers.
IEC 62878-2-5:2019 applies to substrates using organic material. It neither applies to the re-distribution layer (RDL) nor to the electronic modules defined as M-type business model in IEC 62421.
|Publication type||International Standard|
|TC/SC||TC 91 - Electronics assembly technologyrss|
|ICS||31.180 - Printed circuits and boards|
31.190 - Electronic component assemblies
|File size||5658 KB|
The following test report forms are related:
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