Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods
|Publication type||International Standard|
|Available language(s)||English, English/French|
|TC/SC||TC 91 - Electronics assembly technologyrss|
|ICS||31.190 - Electronic component assemblies
31.240 - Mechanical structures for electronic equipment
|File size||2497 KB|
The following test report forms are related:
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