IEC 62435-5:2017 

Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices

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Abstract

IEC 62435-5:2017 is applicable to long-term storage of die and wafer devices and establishes specific storage regimen and conditions for singulated bare die and partial or complete wafers of die including die with added structures such as redistribution layers and solder balls or bumps or other metallisation. This part also provides guidelines for special requirements and primary packaging that contain the die or wafers for handling purposes.  Typically, this part is used in conjunction with IEC 62435-1:2017 for long-term storage of devices whose duration can be more than 12 months for products scheduled for long duration storage.

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Additional information

Publication typeInternational Standard
Publication date2017-01-20
Edition1.0
Available language(s)English/French
TC/SCTC 47 - Semiconductor devicesrss
ICS31.020 - Electronic components in general
Stability date  2022
Pages42
File size1234 KB

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