IEC 62435-5
IEC 62435-5:2017
Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices
IEC 62435-5:2017 is applicable to long-term storage of die and wafer devices and establishes specific storage regimen and conditions for singulated bare die and partial or complete wafers of die including die with added structures such as redistribution layers and solder balls or bumps or other metallisation. This part also provides guidelines for special requirements and primary packaging that contain the die or wafers for handling purposes. Typically, this part is used in conjunction with IEC 62435-1:2017 for long-term storage of devices whose duration can be more than 12 months for products scheduled for long duration storage.
CHFÂ 155.-
Technical committee
TC 47 Semiconductor devices| Publication type | International Standard |
| Publication date | 2017-01-20 |
| Edition | 1.0 |
| ICS | 31.020 |
| Stability date | 2031 |
| ISBN number | 9782832238370 |
| Pages | 42 |
| File size | 1.18 MB |
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