Amendment 1 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Note: a consolidated version of this publication exists
IEC 60068-2-58:2015+AMD1:2017 CSV
|Publication type||International Standard|
|Available language(s)||English, English/French|
|TC/SC||TC 91 - Electronics assembly technologyrss|
|ICS||19.040 - Environmental testing
31.190 - Electronic component assemblies
|File size||1329 KB|
The following test report forms are related:
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