IEC 60068-2-58:2015/AMD1:2017 

Amendment 1 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

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IEC 60068-2-58:2015+AMD1:2017 CSV

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Additional information

Publication typeInternational Standard
Publication date2017-07-28
Edition4.0
Available language(s)English
TC/SCTC 91 - Electronics assembly technologyrss
ICS19.040 - Environmental testing
31.190 - Electronic component assemblies
Stability date  2022
Pages7
File size1329 KB

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