IEC 62148-21:2019 Withdrawn
Fibre optic active components and devices - Package and interface standards - Part 21: Design guide of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)
Abstract
IEC 62148-21:2019 covers the design guide of the electrical interface for photonic integrated circuit (PIC) packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA). In this document, the electrical interface for the S-FBGA package is informative. The purpose of this document is to specify adequately the electrical interface of PIC packages composed of optical transmitters and receivers that enable mechanical and electrical interchangeability of PIC packages.
Keywords: electrical interface of photonic integrated circuit (PIC) packages
Keywords: electrical interface of photonic integrated circuit (PIC) packages
Additional information
Publication type | International Standard |
---|---|
Publication date | 2019-03-11 |
Withdrawal date | 2021-04-22 |
Edition | 1.0 |
Available language(s) | English/French |
TC/SC | TC 86/SC 86C - Fibre optic systems and active devicesrss |
ICS | 33.180.20 - Fibre optic interconnecting devices |
Stability date | 2021 |
Pages | 25 |
File size | 1585 KB |
The following test report forms are related:
Share your publications
Learn how to share your publications with your colleagues, using networking options.
Payment information
Our prices are in Swiss francs (CHF). We accept all major credit cards (American Express, Mastercard and Visa, JCB and CUP), PayPal and bank transfers as form of payment.
Keep in touch
Keep up to date with new publication releases and announcements with our free IEC Just Published email newsletter.
Contact customer services
Please send your enquiry by email or call us on +41 22 919 02 11 between 09:00 – 16:00 CET Monday to Friday.