IEC 62148-21:2019 Withdrawn

Fibre optic active components and devices - Package and interface standards - Part 21: Design guide of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)

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Abstract

IEC 62148-21:2019 covers the design guide of the electrical interface for photonic integrated circuit (PIC) packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA). In this document, the electrical interface for the S-FBGA package is informative. The purpose of this document is to specify adequately the electrical interface of PIC packages composed of optical transmitters and receivers that enable mechanical and electrical interchangeability of PIC packages.
Keywords: electrical interface of photonic integrated circuit (PIC) packages

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Relevant for

fibre optics


Additional information

Publication typeInternational Standard
Publication date2019-03-11
Withdrawal date2021-04-22
Edition1.0
Available language(s)English/French
TC/SCTC 86/SC 86C - Fibre optic systems and active devicesrss
ICS33.180.20 - Fibre optic interconnecting devices
Stability date  2021
Pages25
File size1585 KB

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