Fibre optic active components and devices – Package and interface standards – Part 21: Design guide of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)
Keywords: electrical interface of photonic integrated circuit (PIC) packages
|Publication type||International Standard|
|TC/SC||TC 86/SC 86C - Fibre optic systems and active devicesrss|
|ICS||33.180.20 - Fibre optic interconnecting devices|
|File size||1548 KB|
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