IEC 60749-3
IEC 60749-3:2017
Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
IEC 60749-3:2017 is to verify that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types. The test is useful for qualification, process monitor, or lot acceptance.
This edition includes the following significant technical changes with respect to the previous edition:
a) reference to the need for ESD protection;
b) inclusion of information on the phenomenon of tin whiskers;
c) inclusion of an optional report form/checklist.
This edition includes the following significant technical changes with respect to the previous edition:
a) reference to the need for ESD protection;
b) inclusion of information on the phenomenon of tin whiskers;
c) inclusion of an optional report form/checklist.
CHFÂ 40.-
Technical committee
TC 47 Semiconductor devices| Publication type | International Standard |
| Publication date | 2017-03-03 |
| Edition | 2.0 |
| ICS | 31.080.01 |
| Stability date | 2031 |
| ISBN number | 9782832273180 |
| Pages | 11 |
| File size | 952.47 KB |
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