IEC 60749-3:2017 

Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination


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IEC 60749-3:2017 is to verify that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types. The test is useful for qualification, process monitor, or lot acceptance.
This edition includes the following significant technical changes with respect to the previous edition:
a) reference to the need for ESD protection;
b) inclusion of information on the phenomenon of tin whiskers;
c) inclusion of an optional report form/checklist.

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Additional information

Publication typeInternational Standard
Publication date2017-03-03
Available language(s)English, English/French
TC/SCTC 47 - Semiconductor devicesrss
ICS31.080.01 - Semiconductor devices in general
Stability date  2027
File size1091 KB

The following test report forms are related:

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