IEC 60749-10:2002 Withdrawn
Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
Abstract
Describes a shock test intended to determine the suitability of component parts for use in electronic equipment which may be subjected to moderately severe shocks as a result of suddenly applied forces or abrupt changes in motion produced by rough handling, transportation, or field operation. Shock of this type may disturb operating characteristics, particularly if the shock pulses are repetitive. This is a destructive test. It is normally applicable to cavity-type packages.
The contents of the corrigendum of August 2003 have been included in this copy.
Additional information
Publication type | International Standard |
---|---|
Publication date | 2002-04-09 |
Withdrawal date | 2022-04-27 |
Edition | 1.0 |
Available language(s) | English/French, Spanish |
TC/SC | TC 47 - Semiconductor devicesrss |
ICS | 31.080.01 - Semiconductor devices in general |
Stability date | 2022 |
Pages | 7 |
File size | 421 KB |
The following test report forms are related:
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