IEC 60749-14:2003 

Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)

CHF 

Do you need a multi-user copy?

CHF 

Preview

Abstract

Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly. Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.

Look inside


Additional information

Publication typeInternational Standard
Publication date2003-08-07
Edition1.0
Available language(s)English/French, Spanish
TC/SCTC 47 - Semiconductor devicesrss
ICS31.080.01 - Semiconductor devices in general
Stability date  2021
Pages27
File size451 KB

The following test report forms are related:



Share your publications

Learn how to share your publications with your colleagues, using networking options.

Payment information

Our prices are in Swiss francs (CHF). We accept all major credit cards (American Express, Mastercard and Visa), PayPal and bank transfers as form of payment.


Keep in touch

Keep up to date with new publication releases and announcements with our free IEC Just Published email newsletter.

Contact customer services

Please send your enquiry by email or call us on +41 22 919 02 11 between 09:00 – 17:00 CET Monday to Friday.