IEC 60749-14:2003
Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)
Abstract
Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly.
Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.
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Additional information
| Publication type | International Standard |
|---|---|
| Publication date | 2003-08-07 |
| Edition | 1.0 |
| Available language(s) | English/French, Spanish |
| TC/SC | TC 47 - Semiconductor devicesrss |
| ICS | 31.080.01 - Semiconductor devices in general |
| Stability date | 2029 |
| Pages | 27 |
| File size | 451 KB |
The following test report forms are related:
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