IEC 60749-14
IEC 60749-14:2003
Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)
Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly.
Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.
Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.
CHFÂ 80.-
Technical committee
TC 47 Semiconductor devices| Publication type | International Standard |
| Publication date | 2003-08-07 |
| Edition | 1.0 |
| ICS | 31.080.01 |
| Stability date | 2029 |
| ISBN number | 2831871328 |
| Pages | 27 |
| File size | 440.17 KB |
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