IEC 60749-16
IEC 60749-16:2003
Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)
Defines a test aiming at detecting the presence of loose particles inside a cavity device such as, for example, chips of ceramic, pieces of bonding wire or solder balls (prills).
CHFÂ 20.-
Technical committee
TC 47 Semiconductor devicesCategory
Environment| Publication type | International Standard |
| Publication date | 2003-01-17 |
| Edition | 1.0 |
| ICS | 31.080.01 |
| Stability date | 2031 |
| ISBN number | 2831867991 |
| Pages | 13 |
| File size | 166.89 KB |
Build resilient infrastructure, promote inclusive and sustainable industrialization and foster innovation