IEC 60749-16:2003 

Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)

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Abstract

Defines a test aiming at detecting the presence of loose particles inside a cavity device such as, for example, chips of ceramic, pieces of bonding wire or solder balls (prills).

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Additional information

Publication typeInternational Standard
Publication date2003-01-17
Edition1.0
Available language(s)English/French, Spanish
TC/SCTC 47 - Semiconductor devicesrss
ICS31.080.01 - Semiconductor devices in general
Stability date  2019
Pages13
File size171 KB

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