IEC 60749-19:2003 

Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength

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IEC 60749-19:2003+AMD1:2010 CSV

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Abstract

Determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates. Generally only applicable to cavity packages or as a process monitor.

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Additional information

Publication typeInternational Standard
Publication date2003-02-13
Edition1.0
Available language(s)English/French, Spanish
TC/SCTC 47 - Semiconductor devicesrss
ICS31.080.01 - Semiconductor devices in general
Stability date  2025
Pages11
File size143 KB

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