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IEC 60749-19:2003+AMD1:2010 CSV
IEC 60749-19
IEC 60749-19:2003
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
Determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates. Generally only applicable to cavity packages or as a process monitor.
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Consolidated version
The content of amendment(s) is incorporated into the publication. The track changes mode shows where the publication has been modified by the amendment.
DiscoverTechnical committee
TC 47 Semiconductor devices| Publication type | International Standard |
| Publication date | 2003-02-13 |
| Edition | 1.0 |
| ICS | 31.080.01 |
| Stability date | 2030 |
| ISBN number | 2831868408 |
| Pages | 11 |
| File size | 106.91 KB |
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