IEC 60749-19:2003
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
Note: a more recent version of this publication exists
IEC 60749-19:2003+AMD1:2010 CSV
Abstract
Determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates. Generally only applicable to cavity packages or as a process monitor.
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Additional information
| Publication type | International Standard |
|---|---|
| Publication date | 2003-02-13 |
| Edition | 1.0 |
| Available language(s) | English/French, Spanish |
| TC/SC | TC 47 - Semiconductor devicesrss |
| ICS | 31.080.01 - Semiconductor devices in general |
| Stability date | 2030 |
| Pages | 11 |
| File size | 143 KB |
The following test report forms are related:
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