IEC 60749-19:2003+AMD1:2010 CSV 
Consolidated version

Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength

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Abstract

IEC 60749-19:2003+A1:2010 determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates. This test method is generally only applicable to cavity packages or as a process monitor. It is not applicable for die areas greater than 10 mm2. It is also not applicable to flip chip technology or to flexible substrates. This consolidated version consists of the first edition (2003) and its amendment 1 (2010). Therefore, no need to order amendment in addition to this publication.

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Additional information

Publication typeInternational Standard
Publication date2010-11-29
Edition1.1
Available language(s)English/French
TC/SCTC 47 - Semiconductor devicesrss
ICS31.080.01 - Semiconductor devices in general
Stability date  2025
Pages13
File size886 KB

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