IEC 60749-19:2003+AMD1:2010 CSV
Consolidated version
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
Abstract
IEC 60749-19:2003+A1:2010 determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates. This test method is generally only applicable to cavity packages or as a process monitor. It is not applicable for die areas greater than 10 mm2. It is also not applicable to flip chip technology or to flexible substrates. This consolidated version consists of the first edition (2003) and its amendment 1 (2010). Therefore, no need to order amendment in addition to this publication.
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Additional information
| Publication type | International Standard |
|---|---|
| Publication date | 2010-11-29 |
| Edition | 1.1 |
| Available language(s) | English/French |
| TC/SC | TC 47 - Semiconductor devicesrss |
| ICS | 31.080.01 - Semiconductor devices in general |
| Stability date | 2030 |
| Pages | 13 |
| File size | 913 KB |
The following test report forms are related:
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