IEC 60749-22
IEC 60749-22:2002/COR1:2003
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
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Technical committee
TC 47 Semiconductor devices| Publication type | International Standard |
| Publication date | 2003-08-13 |
| Edition | 1.0 |
| ICS | 31.080.01 |
| Stability date | 2026 |
| File size | 58.38 KB |
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