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IEC 60749-23:2004+AMD1:2011 CSV
IEC 60749-23
IEC 60749-23:2004
Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
This test is used to determine the effects of bias conditions and temperature on solid state devices over time. It simulates the device operating condition in an accelerated way, and is primarily used for device qualification and reliability monitoring.
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Consolidated version
The content of amendment(s) is incorporated into the publication. The track changes mode shows where the publication has been modified by the amendment.
DiscoverTechnical committee
TC 47 Semiconductor devicesPublication type | International Standard |
Publication date | 2004-02-23 |
Edition | 1.0 |
ICS | 31.080.01 |
Stability date | 2026 |
ISBN number | 2831873983 |
Pages | 17 |
File size | 378.90 KB |
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