IEC 60749-23:2004
Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
Note: a more recent version of this publication exists
IEC 60749-23:2004+AMD1:2011 CSV
Abstract
This test is used to determine the effects of bias conditions and temperature on solid state devices over time. It simulates the device operating condition in an accelerated way, and is primarily used for device qualification and reliability monitoring.
Additional information
Publication type | International Standard |
---|---|
Publication date | 2004-02-23 |
Edition | 1.0 |
Available language(s) | English/French, Spanish |
TC/SC | TC 47 - Semiconductor devicesrss |
ICS | 31.080.01 - Semiconductor devices in general |
Stability date | 2026 |
Pages | 17 |
File size | 388 KB |
The following test report forms are related:
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