IEC 60749-25
IEC 60749-25:2003
Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling
Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses. Applies to single, dual and triple chamber temperature cycling and covers component and solder interconnection testing.
CHFÂ 80.-
Technical committee
TC 47 Semiconductor devices| Publication type | International Standard |
| Publication date | 2003-07-11 |
| Edition | 1.0 |
| ICS | 31.080.01 |
| Stability date | 2026 |
| ISBN number | 2831871107 |
| Pages | 25 |
| File size | 499.19 KB |
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