IEC 60749-25:2003 

Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling

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Abstract

Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses. Applies to single, dual and triple chamber temperature cycling and covers component and solder interconnection testing.

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Additional information

Publication typeInternational Standard
Publication date2003-07-11
Edition1.0
Available language(s)English/French, Spanish
TC/SCTC 47 - Semiconductor devicesrss
ICS31.080.01 - Semiconductor devices in general
Stability date  2025
Pages25
File size511 KB

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