IEC 60749-25:2003
Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling
Abstract
Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses. Applies to single, dual and triple chamber temperature cycling and covers component and solder interconnection testing.
Additional information
Publication type | International Standard |
---|---|
Publication date | 2003-07-11 |
Edition | 1.0 |
Available language(s) | English/French, Spanish |
TC/SC | TC 47 - Semiconductor devicesrss |
ICS | 31.080.01 - Semiconductor devices in general |
Stability date | 2026 |
Pages | 25 |
File size | 511 KB |
The following test report forms are related:
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