IEC 60749-30:2005+AMD1:2011 CSV 
Consolidated version

Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

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Abstract

IEC 60749-30:2005+A1:2011 establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing. The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple solder reflow operation. These SMDs should be subjected to the appropriate preconditioning sequence described in this standard prior to being submitted to specific in-house reliability testing (qualification and/or reliability monitoring) in order to evaluate long term reliability (impacted by soldering stress). This consolidated version consists of the first edition (2005) and its amendment 1 (2011). Therefore, no need to order amendment in addition to this publication.

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Additional information

Publication typeInternational Standard
Publication date2011-08-10
Edition1.1
Available language(s)English/French
TC/SCTC 47 - Semiconductor devicesrss
ICS31.080.01 - Semiconductor devices in general
Stability date  2022
Pages28
File size1106 KB

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