IEC 63011-2:2018 

Integrated circuits - Three dimensional integrated circuits - Part 2: Alignment of stacked dies having fine pitch interconnect


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IEC 63011-2:2018 provides specifications of initial alignment and alignment maintenance between multiple stacked integrated circuits during the die bonding process. These specifications define the alignment keys and operating procedures of the keys. These specifications apply only if electrical coupling method of die-to-die alignment is used in the die stacking.

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Additional information

Publication typeInternational Standard
Publication date2018-11-28
Available language(s)English/French
TC/SCTC 47/SC 47A - Integrated circuitsrss
ICS31.200 - Integrated circuits. Microelectronics
Stability date  2029
File size1611 KB

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