IEC 63011-2:2018
Integrated circuits - Three dimensional integrated circuits - Part 2: Alignment of stacked dies having fine pitch interconnect
Abstract
IEC 63011-2:2018 provides specifications of initial alignment and alignment maintenance between multiple stacked integrated circuits during the die bonding process. These specifications define the alignment keys and operating procedures of the keys. These specifications apply only if electrical coupling method of die-to-die alignment is used in the die stacking.
Additional information
Publication type | International Standard |
---|---|
Publication date | 2018-11-28 |
Edition | 1.0 |
Available language(s) | English/French |
TC/SC | TC 47/SC 47A - Integrated circuitsrss |
ICS | 31.200 - Integrated circuits. Microelectronics |
Stability date | 2024 |
Pages | 28 |
File size | 1611 KB |
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