IEC 60749-32:2002
Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
Note: a more recent version of this publication exists
IEC 60749-32:2002+AMD1:2010 CSV
Abstract
Applicable to semiconductor devices (discrete devices and integrated circuits), this test determines whether the device ignites due to external heating. The test uses a needle flame, simulating the effect of small flames which may result from fault conditions within equipment containing the device. The contents of the corrigendum of August 2003 have been included in this copy.
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Additional information
| Publication type | International Standard |
|---|---|
| Publication date | 2002-08-30 |
| Edition | 1.0 |
| Available language(s) | English/French, Spanish |
| TC/SC | TC 47 - Semiconductor devicesrss |
| ICS | 31.080.01 - Semiconductor devices in general |
| Stability date | 2026 |
| Pages | 9 |
| File size | 301 KB |
The following test report forms are related:
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