IEC 60749-33:2004
Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave
Abstract
The unbiased autoclave test is performed to evaluate the moisture resistance integrity of non-hermetically packaged solid-state devices using moisture condensing or moisture saturated steam environments. It is a highly accelerated test which employs conditions of pressure, humidity and temperature under condensing conditions to accelerate moisture penetration through the external protective material or along the interface between the external protective material and the metallic conductors passing through it.
Additional information
Publication type | International Standard |
---|---|
Publication date | 2004-03-09 |
Edition | 1.0 |
Available language(s) | English, English/French, Spanish |
TC/SC | TC 47 - Semiconductor devicesrss |
ICS | 31.080.01 - Semiconductor devices in general |
Stability date | 2029 |
Pages | 17 |
File size | 875 KB |
The following test report forms are related:
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