IEC 60749-35:2006
Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components
Abstract
Defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components. Provides a guide to the use of acoustic microscopy for detecting anomalies (delamination, cracks, mould-compound voids, etc.) reproducibly and non-destructively in plastic packages.
Additional information
Publication type | International Standard |
---|---|
Publication date | 2006-07-18 |
Edition | 1.0 |
Available language(s) | English/French |
TC/SC | TC 47 - Semiconductor devicesrss |
ICS | 31.080.01 - Semiconductor devices in general |
Stability date | 2029 |
Pages | 43 |
File size | 750 KB |
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