IEC 60749-35
IEC 60749-35:2006
Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components
Defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components. Provides a guide to the use of acoustic microscopy for detecting anomalies (delamination, cracks, mould-compound voids, etc.) reproducibly and non-destructively in plastic packages.
CHFÂ 155.-
Technical committee
TC 47 Semiconductor devices| Publication type | International Standard |
| Publication date | 2006-07-18 |
| Edition | 1.0 |
| ICS | 31.080.01 |
| Stability date | 2029 |
| ISBN number | 2831887437 |
| Pages | 43 |
| File size | 732.33 KB |
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