IEC 60749-37:2008 

Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer

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Abstract

Provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface-mounted components while producing the same failure modes normally observed during product level test.

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Additional information

Publication typeInternational Standard
Publication date2008-01-30
Edition1.0
Available language(s)English/French
TC/SCTC 47 - Semiconductor devicesrss
ICS31.080.01 - Semiconductor devices in general
Stability date  2021
Pages39
File size1082 KB

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