IEC 60749-8
IEC 60749-8:2002/COR1:2003
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
CHFÂ 0.-
Technical committee
TC 47 Semiconductor devices| Publication type | International Standard |
| Publication date | 2003-04-23 |
| Edition | 1.0 |
| ICS | 31.080.01 |
| Stability date | 2029 |
| File size | 69.33 KB |
Build resilient infrastructure, promote inclusive and sustainable industrialization and foster innovation