IEC 61188-1-2:1998 

Printed boards and printed board assemblies - Design and use - Part 1-2: Generic requirements - Controlled impedance

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Abstract

The aim in packaging is to transfer a signal from one device to one or more other devices through a conductor. High-speed designs are defined as designs in which the interconnecting properties affect circuit performance and require unique considerations.

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Additional information

Publication typeInternational Standard
Publication date1998-04-29
Edition1.0
Available language(s)English/French
TC/SCTC 91 - Electronics assembly technologyrss
ICS31.180 - Printed circuits and boards
Stability date  2023
Pages83
File size493 KB

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