IEC 61190-1-1:2002 

Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly


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Specifies general requirements for the classification and testing of soldering fluxes for high-quality interconnections in electronics assembly. This standard is a flux characterization, quality control, and procurement document for solder flux and flux containing material in electronics assembly technology.

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Additional information

Publication typeInternational Standard
Publication date2002-03-25
Available language(s)English/French
TC/SCTC 91 - Electronics assembly technologyrss
ICS31.190 - Electronic component assemblies
Stability date  2025
File size587 KB

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