IEC 61190-1-3:2007/AMD1:2010 Withdrawn
Amendment 1 - Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
Additional information
Publication type | International Standard |
---|---|
Publication date | 2010-06-10 |
Withdrawal date | 2017-12-13 |
Edition | 2.0 |
Available language(s) | English/French |
TC/SC | TC 91 - Electronics assembly technologyrss |
ICS | 31.190 - Electronic component assemblies |
Stability date | 2017 |
Pages | 17 |
File size | 970 KB |
The following test report forms are related:
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