IEC 61191-1:2013 Withdrawn
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
Abstract
IEC 61191-1:2013 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies. It also includes recommendations for good manufacturing processes. This edition includes the following significant technical changes with respect to the previous edition:
- reference standard IEC 61192-1 has been replaced by IPC-A-610;
- some of the terminology has been updated;
- references to IEC standards have been corrected;
- the use of lead-free alloys in the assembly have been added.
- reference standard IEC 61192-1 has been replaced by IPC-A-610;
- some of the terminology has been updated;
- references to IEC standards have been corrected;
- the use of lead-free alloys in the assembly have been added.
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Additional information
| Publication type | International Standard |
|---|---|
| Publication date | 2013-05-21 |
| Withdrawal date | 2018-09-14 |
| Edition | 2.0 |
| Available language(s) | English/French |
| TC/SC | TC 91 - Electronics assembly technologyrss |
| ICS | 31.190 - Electronic component assemblies
31.240 - Mechanical structures for electronic equipment |
| Stability date | 2018 |
| Pages | 96 |
| File size | 1636 KB |
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