IEC 61191-2:2013 Withdrawn
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
Abstract
IEC 61191-2:2013 gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through-hole, chip mounting, terminal mounting, etc.). This edition includes the following significant technical changes with respect to the previous edition:
- IPC-A-610 on workmanship has been included as a normative reference;
- some of the terminology used in the document has been updated;
- references to IEC standards have been corrected;
- the use of lead-free solder paste and plating are addressed.
- IPC-A-610 on workmanship has been included as a normative reference;
- some of the terminology used in the document has been updated;
- references to IEC standards have been corrected;
- the use of lead-free solder paste and plating are addressed.
Look inside
Additional information
| Publication type | International Standard |
|---|---|
| Publication date | 2013-06-05 |
| Withdrawal date | 2017-05-23 |
| Edition | 2.0 |
| Available language(s) | English/French |
| TC/SC | TC 91 - Electronics assembly technologyrss |
| ICS | 31.190 - Electronic component assemblies
31.240 - Mechanical structures for electronic equipment |
| Stability date | 2017 |
| Pages | 53 |
| File size | 1491 KB |
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