IEC 61191-3:1998 Withdrawn
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
Abstract
Prescribes requirements for lead and hole solder assembly. The requirements pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).
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Additional information
| Publication type | International Standard |
|---|---|
| Publication date | 1998-08-28 |
| Withdrawal date | 2017-05-30 |
| Edition | 1.0 |
| Available language(s) | English/French |
| TC/SC | TC 91 - Electronics assembly technologyrss |
| ICS | 31.240 - Mechanical structures for electronic equipment |
| Stability date | 2017 |
| Pages | 31 |
| File size | 583 KB |
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