IEC 61192-1:2003 Withdrawn
Workmanship requirements for soldered electronic assemblies - Part 1: General
Abstract
Specifies general requirements for workmanship in soldered electronic assemblies on printed boards and on similar laminates attached to the surface(s) of organic substrates. Defines requirements and guidelines for good workmanship and practice in the preparation, soldering, inspection and testing of electronic and electrical assemblies. Enables achievement of high yields and high product quality through process control in production.
Additional information
Publication type | International Standard |
---|---|
Publication date | 2003-02-20 |
Withdrawal date | 2018-11-30 |
Edition | 1.0 |
Available language(s) | English/French |
TC/SC | TC 91 - Electronics assembly technologyrss |
ICS | 31.190 - Electronic component assemblies |
Stability date | 2018 |
Pages | 147 |
File size | 2129 KB |
The following test report forms are related:
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