IEC 61192-1:2003 Withdrawn

Workmanship requirements for soldered electronic assemblies - Part 1: General

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Abstract

Specifies general requirements for workmanship in soldered electronic assemblies on printed boards and on similar laminates attached to the surface(s) of organic substrates. Defines requirements and guidelines for good workmanship and practice in the preparation, soldering, inspection and testing of electronic and electrical assemblies. Enables achievement of high yields and high product quality through process control in production.

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Additional information

Publication typeInternational Standard
Publication date2003-02-20
Withdrawal date2018-11-30
Edition1.0
Available language(s)English/French
TC/SCTC 91 - Electronics assembly technologyrss
ICS31.190 - Electronic component assemblies
Stability date  2018
Pages147
File size2129 KB

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