IEC 61192-2:2003 Withdrawn

Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies

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Abstract

Specifies requirements for workmanship in soldered surface-mounted electronic assemblies and multichip modules on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. Applies to assemblies that are totally surface-mounted and to the surface-mount portions of assemblies that include other related assembly technologies, for example, through-hole mounting.

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Additional information

Publication typeInternational Standard
Publication date2003-03-14
Withdrawal date2018-11-30
Edition1.0
Available language(s)English/French
TC/SCTC 91 - Electronics assembly technologyrss
ICS31.190 - Electronic component assemblies
Stability date  2018
Pages127
File size3628 KB

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