IEC 61192-3:2002 Withdrawn

Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies


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Specifies general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally through-hole or mixed assemblies that include surface-mounting or other related assembly technologies, for example, terminals, wires.

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Additional information

Publication typeInternational Standard
Publication date2002-12-17
Withdrawal date2018-11-30
Available language(s)English/French
TC/SCTC 91 - Electronics assembly technologyrss
ICS31.190 - Electronic component assemblies
Stability date  2018
File size7695 KB

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