IEC 61192-3:2002 Withdrawn

Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies

English/French
CHF 

Do you need a multi-user copy?

English/French
CHF 

Preview

Abstract

Specifies general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally through-hole or mixed assemblies that include surface-mounting or other related assembly technologies, for example, terminals, wires.

Look inside


Additional information

Publication typeInternational Standard
Publication date2002-12-17
Withdrawal date2018-11-30
Edition1.0
Available language(s)English/French
TC/SCTC 91 - Electronics assembly technologyrss
ICS31.190 - Electronic component assemblies
Stability date  2018
Pages93
File size7695 KB

The following test report forms are related:


Share this page


Share your publications

Learn how to share your publications with your colleagues, using networking options.

Payment information

Our prices are in Swiss francs (CHF). We accept all major credit cards (American Express, Mastercard and Visa), PayPal and bank transfers as form of payment.


Keep in touch

Keep up to date with new publication releases and announcements with our free IEC Just Published email newsletter.

Contact customer services

Please send your enquiry by email or call us on +41 22 919 02 11 between 09:00 – 17:00 CET Monday to Friday.