IEC 61192-5:2007 Withdrawn

Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies

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Abstract

IEC 61192-5:2007 provides information and requirements that are applicable to modification, rework and repair procedures for soldered electronic assemblies. It is applicable to specific processes used to manufacture soldered electronic assemblies where components are attached to printed boards and to the relevant parts of resulting products. The standard is also applicable to activities that can form part of the work in assembling mixed technology products. It also contains guidance on design matters where they have relevance to rework.

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Additional information

Publication typeInternational Standard
Publication date2007-05-23
Withdrawal date2018-11-30
Edition1.0
Available language(s)English, English/French
TC/SCTC 91 - Electronics assembly technologyrss
ICS31.190 - Electronic component assemblies
Stability date  2018
Pages80
File size1426 KB

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