IEC 61192-5:2007 Withdrawn
Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies
Abstract
IEC 61192-5:2007 provides information and requirements that are applicable to modification, rework and repair procedures for soldered electronic assemblies. It is applicable to specific processes used to manufacture soldered electronic assemblies where components are attached to printed boards and to the relevant parts of resulting products. The standard is also applicable to activities that can form part of the work in assembling mixed technology products. It also contains guidance on design matters where they have relevance to rework.
Additional information
Publication type | International Standard |
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Publication date | 2007-05-23 |
Withdrawal date | 2018-11-30 |
Edition | 1.0 |
Available language(s) | English, English/French |
TC/SC | TC 91 - Electronics assembly technologyrss |
ICS | 31.190 - Electronic component assemblies |
Stability date | 2018 |
Pages | 80 |
File size | 1426 KB |
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