IEC 60068-2-83:2011 

Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

English/French
CHF 

Do you need a multi-user copy?

English/French
CHF 

Preview

Abstract

IEC 60068-2-83:2011 provides methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder pastes. Data obtained by these methods are not intended to be used as absolute quantitative data for pass - fail purposes.
NOTE: Different solderability test methods for SMD are described in IEC 60068-2-58 and IEC 60068-2-69. IEC 60068-2-58 prescribes visual evaluation using solder bath and reflow method, IEC 60068-2-69 prescribes wetting balance evaluation using solder bath and solder globule method.

Look inside


Additional information

Publication typeInternational Standard
Publication date2011-09-07
Edition1.0
Available language(s)English/French
TC/SCTC 91 - Electronics assembly technologyrss
ICS19.040 - Environmental testing
31.190 - Electronic component assemblies
Stability date  2023
Pages76
File size1738 KB

The following test report forms are related:



Share your publications

Learn how to share your publications with your colleagues, using networking options.

Payment information

Our prices are in Swiss francs (CHF). We accept all major credit cards (American Express, Mastercard and Visa), PayPal and bank transfers as form of payment.


Keep in touch

Keep up to date with new publication releases and announcements with our free IEC Just Published email newsletter.

Contact customer services

Please send your enquiry by email or call us on +41 22 919 02 11 between 09:00 – 17:00 CET Monday to Friday.