Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
NOTE: Different solderability test methods for SMD are described in IEC 60068-2-58 and IEC 60068-2-69. IEC 60068-2-58 prescribes visual evaluation using solder bath and reflow method, IEC 60068-2-69 prescribes wetting balance evaluation using solder bath and solder globule method.
|Publication type||International Standard|
|TC/SC||TC 91 - Electronics assembly technologyrss|
|ICS||19.040 - Environmental testing
31.190 - Electronic component assemblies
|File size||1738 KB|
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